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| Samsung EMMC | |||||||
| Part Number | Version | Density | Voltage | Interface | Package Size | Temperature | Product Status |
| KLMCG2UCTB-B041 | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | Mass Production |
| KLMDG4UCTB-B041 | eMMC 5.1 | 128 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C | Mass Production |
| KLM4G1FETE-B041 | eMMC 5.1 | 4 GB | 1.8 / 3.3 V | HS400 | 11 x 10 x 0.8 mm | -25 ~ 85 °C | Mass Production |
| KLM8G1GEUF-B04P | eMMC 5.1 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLM8G1GEUF-B04Q | eMMC 5.1 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLMAG2GEUF-B04P | eMMC 5.1 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLMAG2GEUF-B04Q | eMMC 5.1 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLMBG4GEUF-B04P | eMMC 5.1 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLMBG4GEUF-B04Q | eMMC 5.1 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLMCG2KCTA-B041 | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | EOL |
| KLMCG2UCTA-B041 | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | EOL |
| KLMDG4UCTA-B041 | eMMC 5.1 | 128 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C | EOL |
| KLMEG8UCTA-B041 | eMMC 5.1 | 256 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C | EOL |
| KLM8G1GESD-B03P | eMMC 5.0 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLM8G1GESD-B03Q | eMMC 5.0 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLM8G1GESD-B04P | eMMC 5.1 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLM8G1GESD-B04Q | eMMC 5.1 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLM8G1GETF-B041 | eMMC 5.1 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | Mass Production |
| KLMAG1JETD-B041 | eMMC 5.1 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | Mass Production |
| KLMAG2GESD-B03P | eMMC 5.0 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLMAG2GESD-B03Q | eMMC 5.0 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLMAG2GESD-B04P | eMMC 5.1 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLMAG2GESD-B04Q | eMMC 5.1 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLMBG2JETD-B041 | eMMC 5.1 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | Mass Production |
| KLMBG4GESD-B03P | eMMC 5.0 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C | Mass Production |
| KLMBG4GESD-B03Q | eMMC 5.0 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 105 °C | Mass Production |
| KLMBG4GESD-B04P | eMMC 5.1 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C | Mass Production |
| KLMBG4GESD-B04Q | eMMC 5.1 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C | Mass Production |
| KLMCG4JETD-B041 | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C | Mass Production |
| KLMCG4JEUD-B04P | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 85 °C | Mass Production |
| KLMCG4JEUD-B04Q | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 105 °C | Mass Production |
| KLMCG8GESD-B03P | eMMC 5.0 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C | Mass Production |
| KLMCG8GESD-B03Q | eMMC 5.0 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 105 °C | Mass Production |
| KLMCG8GESD-B04P | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C | Mass Production |
| KLMCG8GESD-B04Q | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 105 °C | Mass Production |
| KLMDG8JEUD-B04P | eMMC 5.1 | 128 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 85 °C | Mass Production |
| KLMDG8JEUD-B04Q | eMMC 5.1 | 128 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 105 °C | Mass Production |
| apacity | Part Number | Class | Version | Package |
| 4 GB | THGBM5G5A1JBAIR | Premium | 4.41α | P-VFBGA153- |
| THGBMAG5A1JBAIR* | 4.5 | 1113-0.50-002 | ||
| THGBM5G5A1JBAIT* | 4.41α | P-WFBGA153- | ||
| THGBMAG5A1JBAIT* | 4.5 | 1110-0.50-001 | ||
| THGBMAG5A1JBAWR** | I-Ver. | P-VFBGA153- | ||
| 8 GB | THGBM5G6A2JBAIR | Premium | 4.41α | 1113-0.50-002 |
| THGBMAG6A2JBAIR* | 4.5 | |||
| THGBMAG6A2JBAWR** | I-Ver. | |||
| 16 GB | THGBM5G7A2JBAIR* | Premium | 4.41α | |
| THGBMAG7A2JBAIR* | 4.5 | |||
| THGBM5G7B2JBAIM | Supreme | 4.41α | P-VFBGA169- | |
| THGBMAG7B2JBAIM* | 4.5 | 1216-0.50-001 | ||
| THGBMAG7B2JBAWM** | I-Ver. | |||
| 32 GB | THGBM7G8T4JBAIR* | Prime | P-VFBGA153- | |
| THGBM5G8A4JBAIR* | Premium | 4.41α | 1113-0.50-002 | |
| THGBMAG8A4JBA4R* | 4.5 | |||
| THGBM5G8B4JBAIM | Supreme | 4.41α | P-VFBGA169- | |
| THGBMAG8B4JBAIM* | 4.5 | 1216-0.50-001 | ||
| 64 GB | THGBM7G9T8JBAIG* | Prime | P-TFBGA153- | |
| THGBM5G9A8JBAIG* | Premium | 4.41α | 1113-0.50B4 | |
| THGBMAG9A8JBA4G* | 4.5 | |||
| THGBM5G9B8JBAIE | Supreme | 4.41α | P-TFBGA169- |
| eMMC Part | Part Status Code | Applications | Density | Bus Width | Voltage | Package | Pin Count | Package Size | MMC Interface | RoHS | Operating Temp |
| MTFC16GJDDQ-4M IT | Production | Embedded | 16GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| MTFC16GJUEF-AIT | Production | Automotive | 16GB | x8 | 3.3V | TFBGA | 169-ball | 14 x 18 x 1.2 | Yes | -40C to +85C | |
| MTFC16GJVEC-2M WT | Production | Embedded | 16GB | x8 | 3.3V | WFBGA | 169-ball | 14 x 18 x .8 | 4.41 | Yes | -25C to +85C |
| MTFC16GJVEC-4M IT | Production | Embedded | 16GB | x8 | 3.3V | WFBGA | 169-ball | 14 x 18 x .8 | 4.41 | Yes | -40C to +85C |
| MTFC2GMDEA-0M WT | Production | Embedded | 2GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | 4.41 | Yes | -25C to +85C |
| MTFC2GMVEA-0M WT | EOL Pending | Embedded | 2GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | 4.41 | Yes | -25C to +85C |
| MTFC32GJDDQ-4M IT | Production | Embedded | 32GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| MTFC32GJUEF-AIT | Production | Automotive | 32GB | x8 | 3.3V | TFBGA | 169-ball | 14 x 18 x 1.2 | Yes | -40C to +85C | |
| MTFC32GJVED-3M WT | Production | Embedded | 32GB | x8 | 3.3V | VFBGA | 169-ball | 14 x 18 x 1 | 4.41 | Yes | -25C to +85C |
| MTFC32GJVED-4M IT | Production | Embedded | 32GB | x8 | 3.3V | VFBGA | 169-ball | 14 x 18 x 1 | 4.41 | Yes | -40C to +85C |
| MTFC4GLDDQ-4M IT | Production | Embedded | 4GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| MTFC4GLDEA-0M WT | Production | Embedded | 4GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | 4.41 | Yes | -25C to +85C |
| MTFC4GLUDM-AIT | Production | Automotive | 4GB | x8 | 3.3V | TFBGA | 153-ball | 11.5 x 13 x 1.2 | Yes | -40C to +85C | |
| MTFC4GLVEA-0M WT | EOL Pending | Embedded | 4GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | 4.41 | Yes | -25C to +85C |
| MTFC4GMCDM-1M WT | Production | Embedded | 4GB | x8 | 3.3V | TFBGA | 153-ball | 11.5 x 13 x 1.2 | 4.51 | Yes | -25C to +85C |
| MTFC4GMDEA-1M WT | Production | Embedded | 4GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | 4.41 | Yes | -25C to +85C |
| MTFC4GMDEA-4M IT | Production | Embedded | 4GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | 4.41 | Yes | -25C to +85C |
| MTFC4GMVEA-1M WT | EOL Pending | Embedded | 4GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | 4.41 | Yes | -25C to +85C |
| MTFC4GMVEA-4M IT | EOL Pending | Embedded | 4GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | 4.41 | Yes | -40C to +85C |
| MTFC64GJVDN-3M WT | Production | Embedded | 64GB | x8 | 3.3V | LFBGA | 169-ball | 14 x 18 x 1.4 | 4.41 | Yes | -25C to +85C |
| MTFC64GJVDN-4M IT | Production | Embedded | 64GB | x8 | 3.3V | LFBGA | 169-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| MTFC8GLCDM-1M WT | Sampling | Embedded | 8GB | x8 | 2.7V-3.6V | TFBGA | 153-ball | 11.5 x 13 x 1.2 | 4.51 | Yes | -25C to +85C |
| MTFC8GLDDQ-4M IT | Production | Embedded | 8GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| MTFC8GLDEA-1M WT | Production | Embedded | 8GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | 4.41 | Yes | -25C to +85C |
| MTFC8GLDEA-4M IT | Production | Embedded | 8GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | 4.41 | Yes | -25C to +85C |
| MTFC8GLUDM-AIT | Production | Automotive | 8GB | x8 | 3.3V | TFBGA | 153-ball | 11.5 x 13 x 1.2 | Yes | -40C to +85C | |
| MTFC8GLUEA-AIT | Production | Automotive | 8GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | Yes | -40C to +85C | |
| MTFC8GLVEA-1M WT | EOL Pending | Embedded | 8GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | 4.41 | Yes | -25C to +85C |
| MTFC8GLVEA-4M IT | EOL Pending | Embedded | 8GB | x8 | 3.3V | WFBGA | 153-ball | 11.5 x 13 x .8 | 4.41 | Yes | -40C to +85C |
| N2M400FDA311A3BE | Production | Automotive | 4GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | Yes | -40C to +85C | |
| N2M400FDA311A3BF | Production | Automotive | 4GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | Yes | -40C to +85C | |
| N2M400FDB311A3CE | EOL Pending | Embedded | 4GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| N2M400FDB311A3CF | EOL Pending | Embedded | 4GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| N2M400GDA321A3BE | Production | Automotive | 8GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | Yes | -40C to +85C | |
| N2M400GDA321A3BF | Production | Automotive | 8GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | Yes | -40C to +85C | |
| N2M400GDB321A3CE | EOL Pending | Embedded | 8GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| N2M400GDB321A3CF | EOL Pending | Embedded | 8GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| N2M400HDA321A3BE | Production | Automotive | 16GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | -40C to +85C | ||
| N2M400HDA321A3BF | Production | Automotive | 16GB | x8 | 3.3V | LBGA | 14 x 18 x 1.4 | -40C to +85C | |||
| N2M400HDB321A3CE | EOL Pending | Embedded | 16GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| N2M400HDB321A3CF | Production | Embedded | 16GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| N2M400JDA341A3BE | Production | Automotive | 32GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | Yes | -40C to +85C | |
| N2M400JDA341A3BF | Production | Automotive | 32GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | Yes | -40C to +85C | |
| N2M400JDB341A3CE | EOL Pending | Embedded | 32GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| N2M400JDB341A3CF | EOL Pending | Embedded | 32GB | x8 | 3.3V | LBGA | 100-ball | 14 x 18 x 1.4 | 4.41 | Yes | -40C to +85C |
| N2M400KDA345K3BE | End of Life | Automotive | 64GB | x8 | 3.3V | LBGA | 169-ball | 14 x 18 x 1.4 | Yes | -40C to +85C | |
| N2M400KDA345K3BF | End of Life | Automotive | 64GB | x8 | 3.3V | LBGA | 169-ball | 14 x 18 x 1.4 | Yes | -40C to +85C | |
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